ASTM B867-1995(2008) 工程用钯-镍电镀层的标准规范
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【英文标准名称】:StandardSpecificationforElectrodepositedCoatingsofPalladium-NickelforEngineeringUse
【原文标准名称】:工程用钯-镍电镀层的标准规范
【标准号】:ASTMB867-1995(2008)
【标准状态】:现行
【国别】:美国
【发布日期】:1995
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:B08.08.01
【标准类型】:(Specification)
【标准水平】:()
【中文主题词】:
【英文主题词】:Compositecoatings--specifications;Electrodepositedcoatings--specifications;Engineeredelectrodepositedcoatings--specifications;Palladium-nickelelectrodepositedcoatings
【摘要】:1.1Composition8212;Thisspecificationcoversrequirementsforelectrodepositedpalladium-nickelcoatingscontainingbetween70and95mass%ofpalladiummetal.Compositecoatingsconsistingofpalladium-nickelandathingoldoverplateforapplicationsinvolvingelectricalcontactsarealsocovered.1.2Properties8212;Palladiumisthelightestandleastnobleoftheplatinumgroupmetals.Palladium-nickelisasolidsolutionalloyofpalladiumandnickel.Electroplatedpalladium-nickelalloyshaveadensitybetween10and11.5,whichissubstantiallylessthanelectroplatedgold(17.0to19.3)andcomparabletoelectroplatedpurepalladium(10.5to11.8).Thisyieldsagreatervolumeorthicknessofcoatingperunitmassand,consequently,somesavingofmetalweight.Thehardnessrangeofelectrodepositedpalladium-nickelcomparesfavorablywithelectroplatednoblemetalsandtheiralloys(1,2).Note18212;Electroplateddepositsgenerallyhavealowerdensitythantheirwroughtmetalcounterparts.ApproximateHardness(HK25)
Gold
50x2013;250
Palladium
75x2013;600
Platinum
150x2013;550
Palladium-Nickel
300x2013;650
Rhodium
750x2013;1100
Ruthenium
600x2013;1300
【原文标准名称】:工程用钯-镍电镀层的标准规范
【标准号】:ASTMB867-1995(2008)
【标准状态】:现行
【国别】:美国
【发布日期】:1995
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:B08.08.01
【标准类型】:(Specification)
【标准水平】:()
【中文主题词】:
【英文主题词】:Compositecoatings--specifications;Electrodepositedcoatings--specifications;Engineeredelectrodepositedcoatings--specifications;Palladium-nickelelectrodepositedcoatings
【摘要】:1.1Composition8212;Thisspecificationcoversrequirementsforelectrodepositedpalladium-nickelcoatingscontainingbetween70and95mass%ofpalladiummetal.Compositecoatingsconsistingofpalladium-nickelandathingoldoverplateforapplicationsinvolvingelectricalcontactsarealsocovered.1.2Properties8212;Palladiumisthelightestandleastnobleoftheplatinumgroupmetals.Palladium-nickelisasolidsolutionalloyofpalladiumandnickel.Electroplatedpalladium-nickelalloyshaveadensitybetween10and11.5,whichissubstantiallylessthanelectroplatedgold(17.0to19.3)andcomparabletoelectroplatedpurepalladium(10.5to11.8).Thisyieldsagreatervolumeorthicknessofcoatingperunitmassand,consequently,somesavingofmetalweight.Thehardnessrangeofelectrodepositedpalladium-nickelcomparesfavorablywithelectroplatednoblemetalsandtheiralloys(1,2).Note18212;Electroplateddepositsgenerallyhavealowerdensitythantheirwroughtmetalcounterparts.ApproximateHardness(HK25)
Gold
50x2013;250
Palladium
75x2013;600
Platinum
150x2013;550
Palladium-Nickel
300x2013;650
Rhodium
750x2013;1100
Ruthenium
600x2013;1300
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